The equipment located in the Nanofabrication Facility is listed here with links for more detailed information on each tool. There is a wide selection of process tools including fourteen sputtering systems for thin film development, and a multiplexed ICP RIE system for deep silicon etching of MEMS structures. Sub-micron features are defined with a GCA 4800 wafer stepper and a focused ion beam system with 5nm beam resolution. Optical and electron beam generated masks are designed in house and fabricated at commercial mask making facilities.