Nanofab Sputtering System #4
| Overview |
| This system is the fourth generation of five-target sputtering machines built in-house. It features five 5" targets in a sideways sputtering configuration with up to five substrates mounted on a water-cooled table with programmable positioning. Pumpdown is operator controlled via a switch panel. Substrates may be 1", 2" or 3" wafers. A wide variety of materials can be deposited using RF or DC Magnetron sputtering, and a separate power supply provides power to the substrate table for bias sputtering or sputter etch. Argon is the standard sputtering gas, while nitrogen and oxygen are available as secondary gases for reactive sputtering. Please discuss your project with the Nanofab Director to find out which sputtering system(s) would best suit your work. |
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Five 5" Targets
Five Substrates, 1"-3" wafer
For Targets: 2 600W RF Power Supplies with Auto-Tune Matching Networks
For Targets: 2 500W DC Power Supplies
For Substrate Table: 1 600W RF Power Supply with Auto-Tune Matching Network
Ar, N2 and O2 sputtering gases
Programmable Substrate Positioning
8" Cryo Pump
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| Matt Moneck |
mmoneck@ece.cmu.edu |
REH 245 |
x8-4019 |
 | Carnegie Mellon Nanofabrication Facility • ECE Department
Pittsburgh, PA 15213-3891 USA
412-268-2471 - (FAX) 412-268-4323
copyright 2006 Carnegie Mellon |
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