Nanofab Sputtering System #5
| Overview |
| This system is the fifth generation of five-target sputtering machines built in-house. It features five 5" targets in a sideways sputtering configuration with a loadlock to transfer a substrate to a water-cooled table with programmable positioning. Pumpdown is operator controlled via a switch panel. Substrates may be 1", 2" or 3" wafers. A wide variety of materials can be deposited using RF or DC Magnetron sputtering, and a separate power supply provides power to the substrate table for bias sputtering or sputter etch. Argon is the standard sputtering gas, while nitrogen and oxygen are available as secondary gases for reactive sputtering. In addition, a small turbomolecular pump has been added for oxygen-rich sputtering and thin film oxidation. Please discuss your project with the Nanofab Director to find out which sputtering system(s) would best suit your work. |
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Five 5" Targets
One Substrate, 1"-3" wafer
Load Lock
For Targets: 2 600W RF Power Supplies with Auto-Tune Matching Networks
For Targets: 1 10kW DC Power Supply; 1 5kW DC Power Supply
For Substrate Table: 1 600W RF Power Supply with Auto-Tune Matching Network
Ar, N2 and O2 sputtering gases
Programmable Substrate Positioning
8" Cryo Pump
Turbo Pump for Oxygen Service
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| Jeong-Heon Park |
@ece.cmu.edu |
REH 2xx |
x8-0000 |
 | Carnegie Mellon Nanofabrication Facility • ECE Department
Pittsburgh, PA 15213-3891 USA
412-268-2471 - (FAX) 412-268-4323
copyright 2006 Carnegie Mellon |
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