Equipment : Nanofab Sputtering System #5
- Five targets, RF or DC, 5" or 75 mm
- Single substrate, 1" 2" and 3" wafer
- Load lock
- Programmable substrate positioning
- Variable target-substrate distance
- 8" cryo pump
- Separate pumping system for oxidation (e.g. for tunnel junctions)
- 500 W DC power supplies, 600 W RF power supplies, substrate bias
- Secondary sputtering gas available
Available Targets: Please discuss with the staff.
Please consult Nanofab staff for process specifics.